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MAX3863EGJ Rev. A
RELIABILITY REPORT FOR MAX3863EGJ PLASTIC ENCAPSULATED DEVICES
July 20, 2002
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX3863 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX3863 is designed for direct modulation of laser diodes at data rates up to 2.7Gbps. An automatic powercontrol (APC) loop is incorporated to maintain a constant average optical power. Modulation compensation is available to increase the modulation current in proportion to the bias current. The optical extinction ratio is then maintained over temperature and lifetime. The laser driver can modulate laser diodes at amplitudes up to 80mA. Typical (20% to 80%) edge speeds are 50ps. The MAX3863 can supply a bias current up to 100mA. External resistors can set the laser output levels. The MAX3863 includes adjustable pulse-width control to minimize laser pulse-width distortion. The device offers a failure monitor output to indicate when the APC loop is unable to maintain the average optical power. The MAX3863 accepts differential CML clock and data input signals with on-chip 50 termination resistors. If a clock signal is available, an input data-retiming latch can be used to reject input pattern-dependent jitter. The laser driver is fabricated with Maxim's in-house second-generation SiGe process. B. Absolute Maximum Ratings Item Supply Voltage, VCC DATA+, DATA- and CLK+, CLKRTEN , EN , BIAS, MK+, MK-, PWC+, PWC-MODMON, BIASMON, MDMON, MODCOMP,APCFILT1, APCFILT2, BIASMAX, MODSET,APCSET Voltage MOD, MODN Voltage MOD, MODN Current BIAS Current MD Current Operating Junction Temperature Range Storage Temperature Range Lead Temperature (soldering, 10sec) Continuous Power Dissipation (TA = +85C) 32-Pin TQFP Derates above +85C 32-Pin TQFP Rating -0.5V to +7.0V (VCC - 1.5V) to (VCC + 0.5V)
-0.5V to VCC + 0.5V 0 to VCC + 1.5V -20mA to +150mA -20mA to +150mA -5mA to +5mA -55C to +150C -55C to +150C +300C 1.3W 21.1mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: 2.7Gbps Laser Driver with Modulation Compensation F60 1786 Oregon, USA Korea January, 2002
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 32-Pin TQFP Copper Solder Plate Silver-filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-7001-0506 Class UL94-V0
Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 81 x 81 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Poly / Au None Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn) Metal1: 1.6; Metal2: 1.6; Metal3: 1.6; Metal4: 4.2 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening
(Reliability Lab Manager) (Executive Director of QA) (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 150C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 9823 x 44 x 2 Thermal acceleration factor assuming a 0.8eV activation energy = 11.03 x 10-9 = 11.03 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to assure the reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on lots exceeding this level. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M). B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The HF87 die type has been found to have all pins able to withstand a transient pulse of 400V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 200mA.
Table 1 Reliability Evaluation Test Results MAX3863EGJ
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION PACKAGE SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 150C Biased Time = 192 hrs.
DC Parameters & functionality
44
0
Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs. DC Parameters & functionality TQFP 77 0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process Data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
Mil Std 883D Method 3015.7 Notice 8
TERMINAL D

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